PS5 Will Utilize Liquid Metal Technique for Cooling, According to Released Patent

PS5 Will Utilize Liquid Metal Technique for Cooling, According to Released Patent

PS5 will utilize a liquid metal cooling system, according to a patent filled last year under Sony that has recently released to the public.

Through a recently released patent filed just last year, Sony has revealed that their next-gen PS5 console will be using a liquid cooling technique to counteract limitations of thermal paste or grease. According to an English translated version of the official document, the cooling system will use a variety of metal alloys (some that include silver and cooper) that remain liquid at room temperature. Below are a few of the diagrams that demonstrate how the technology will work with the heat sink:

The patent also details the seals that would contain the liquid metal, made of an “ultraviolet cured resin” that will ensure it doesn’t leak into the system. The liquid metal will only be applied to the heat sink itself (as an alternative to thermal paste / grease), with the rest of the system still using fans and airflow to carry the heat out of the system.

The patent excerpts below delve a bit more into the process of the liquid cooling system:

“When the heat generation amount of the semiconductor chip increases, it becomes difficult to sufficiently cool the semiconductor chip due to the thermal resistance possessed by the grease. In the semiconductor device…a metal liquefied by heat at the time of operation of a semiconductor chip is used as a heat conductive material between the semiconductor chip and the radiator in place of grease. When such a metal is used, the thermal resistance between the semiconductor chip and the radiator is lowered, and the cooling performance of the semiconductor chip can be improve.

​”In a structure using a metal having fluidity as a heat conductive material, in order to sufficiently exhibit cooling performance, it is important to limit a range in which the heat conductive material spreads even when a posture change or vibration of the semiconductor device occurs. Furthermore, when the heat sink is pressed against the semiconductor chip, it is important that the force acts sufficiently on the semiconductor chip. That is, adhesion between the semiconductor chip and the radiator is also important.”

It’s important to note that this tech isn’t 100 percent confirmation of the PS5 using this exact system. However, the timing is what’s important here and this patent shows some insight into the kind of architect the system will most likely be using. If you need a refresher on what we know so far about the PS5, check out this informative piece from our Features Editor Ryan Meitzler.

Meanwhile you can also read why our Editor-in-Chief believes that exclusive content is a good thing for the PS5, why next-gen console launches should be delayed until 2021, and why mounting frustration with developing for multiple generations could give PS5 the edge over Xbox Series X.

In other recent news, according to a recent job listing Sony is already developing the next gen version of PSVR — specifically “development of head-mounted display for next-generation VR.” Several leaks have also been surfacing about the PS5’s DualSense controller and how it reportedly has a much larger battery capacity than the DualShock 4. And despite rumors flying around stating otherwise, the developers of Quantum Error have confirmed that the PS5 has no issue hitting native 4K 60FPS.


[Editor’s Note: We have since modified the headline and body to make it more clear that this is not a cooling system (like a water-cooled PC, for instance) and is instead a liquid metal application that will look to overperform traditional thermal paste applications that are common in the industry.]